| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure which inhibits adjacent connection members from being short circuited.SOLUTION: A semiconductor device comprises a semiconductor chip SC mounted on a lead frame by using a plurality of connection members CON. Each connection member CON is provided on each of a plurality of electrodes. The connection member CON is a multiple-stage bumps in which a plurality of bumps are stacked. At least one pair of adjacent two connection members CON have top edges inclining in directions apart from each other. The centers of the plurality of bumps lie on the same linear line. When viewed in a cross section which is perpendicular to a substrate and includes the linear line, it is preferable that the center of some bump and the center of the bump next above the some bump have deviations of not less than 10% and not more than 25% of a width of the bump. |
