METAL MOLD RELEASE FILM FOR LED SEALING BODY, AND METHOD FOR PRODUCING LED SEALING BODY BY USING THE FILM

摘要

PROBLEM TO BE SOLVED: To provide a mold release film which is neither torn nor causes irregular thickness even when followed on a metal mold having a complicated shape and which is made excellent in mold releasability and the surface state of a resin molding to be obtained by using the mold release film.SOLUTION: The metal mold release film for LED sealing bodies includes: a base material layer C; and an outermost layer A which is disposed on one surface of the base material layer C and contains a copolymer of 4-methyl-1-pentene with α-olefin having 2-20 carbon atoms other than the 4-methyl-1-pentene as a main component. The content ratio of a constituent unit derived from the α-olefin having 2-20 carbon atoms other than the 4-methyl-1-pentene in the copolymer is 3 mass% or more. The outermost layer A is a mold release layer and has 0.5 or more and 8.0 or less dynamic hardness when the maximum indentation depth to be measured at 23°C is defined as D (μm) and the dynamic hardness is defined by the expression:(dynamic hardness)=3.8584×0.5/D.