发明名称 |
METHOD FOR FABRICATING A PACKAGE-IN-PACKAGE FOR HIGH HEAT DISSIPATION |
摘要 |
A method for fabricating a semiconductor system starts with providing a first component including a first semiconductor chip attached to a pad of a first metal leadframe made of a first metal sheet of high thermal conductivity. A second component including a second semiconductor chip attached to a pad of a second metal leadframe made of a second metal sheet wire-bondable on both surfaces is provided. The second component is encapsulated in a polymeric housing leaving un-encapsulated the lead surfaces facing away from the second chip. The polymeric housing of the second component is attached to the first chip using a layer of low thermal conductivity, whereby the un-encapsulated lead surfaces face away from the first chip. Bonding wires are connected to the un-encapsulated surfaces of the second component leads to the leads of the first component. |
申请公布号 |
US2014179064(A1) |
申请公布日期 |
2014.06.26 |
申请号 |
US201414189404 |
申请日期 |
2014.02.25 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
Romig Matthew D.;Milleron Marie-Solange |
分类号 |
H01L21/56;H01L23/00 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Dallas TX US |