| 发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
Disclosed herein is a printed circuit board, including: a base substrate; a non-photosensitive insulating layer formed on the base substrate; a circuit pattern formed on the base substrate and having an upper portion protruded from an upper portion of the non-photosensitive insulating layer; and a dam made of a photosensitive material and formed on the upper portion of the non-photosensitive insulating layer of an outer side of the base substrate. |
| 申请公布号 |
US2014174805(A1) |
申请公布日期 |
2014.06.26 |
| 申请号 |
US201313802553 |
申请日期 |
2013.03.13 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
Haze Takayuki |
| 分类号 |
H05K3/34 |
主分类号 |
H05K3/34 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board, comprising:
a base substrate; a non-photosensitive insulating layer formed on the base substrate; a circuit pattern formed on the base substrate and having an upper portion protruded from an upper portion of the non-photosensitive insulating layer; and a dam made of a photosensitive material and formed on the upper portion of the non-photosensitive insulating layer of an outer side of the base substrate. |
| 地址 |
Suwon KR |
