| 发明名称 |
LOWDIELECTRIC RESIN COMPOSITION, COPPER CLAD LAMINATE USING THE SAME, AND PRINTED CIRCUIT BOARD USING THE SAME |
| 摘要 |
A halogen-free resin composition includes (A) 100 parts by weight of naphthalene epoxy resin; (B) 10 to 100 parts by weight of styrene maleic anhydride copolymer; and (C) 30 to 70 parts by weight of DOPO-containing bisphenol F novolac resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby attain a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards. |
| 申请公布号 |
US2014174802(A1) |
申请公布日期 |
2014.06.26 |
| 申请号 |
US201313777477 |
申请日期 |
2013.02.26 |
| 申请人 |
CO., LTD ELITE ELECTRONIC MATERIAL (KUNSHAN) |
发明人 |
WANG RONG-TAO;LEE TSE-AN;CHEN YI-JEN;TIAN WENJUN;MA ZIQIAN;LU WENFENG |
| 分类号 |
H05K1/03;B32B27/06 |
主分类号 |
H05K1/03 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A halogen-free resin composition, comprising:
(A) 100 parts by weight of naphthalene epoxy resin; (B) 10 to 100 parts by weight of styrene maleic anhydride copolymer; and (C) 30 to 70 parts by weight of DOPO-containing bisphenol F novolac resin. |
| 地址 |
US |
