CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

A circuit board and a manufacturing method thereof are provided. A dielectric layer is formed on a substrate, wherein an internal circuit layer is formed on the substrate and the dielectric layer covers the internal circuit layer. A first trench, a second trench and an opening are formed in the dielectric layer. The opening is located below the first trench and connected with the first trench, and a portion of the internal circuit layer is exposed by the opening. A patterned conductive layer is formed on the dielectric layer. The patterned conductive layer covers a portion of the dielectric layer and fills the first trench, the second trench and the opening so as to form a first circuit layer, a second circuit layer and a conductive through via, respectively, wherein the conductive through via is electrically connected with the first circuit layer and the internal circuit layer.

主权项

1. A manufacturing method of a circuit board comprising:
forming a dielectric layer on a substrate, wherein the substrate has an internal circuit layer formed thereon, and the dielectric layer covers the internal circuit layer; forming a first trench, a second trench, and an opening in the dielectric layer, wherein the opening is located below the first trench and is connected with the first trench, and the opening exposes a portion of the internal circuit layer; forming a patterned conductive layer on the dielectric layer, the patterned conductive layer covering a portion of the dielectric layer and filling the first trench, the second trench and the opening, so as to form a first circuit layer, a second circuit layer and a conductive through via, wherein the conductive through via is electrically connected with the first circuit layer and the internal circuit layer.