发明名称 PLASMA ENHANCED DEPOSITION ARRANGEMENT FOR EVAPORATION OF DIELECTRIC MATERIALS, DEPOSITION APPARATUS AND METHODS OF OPERATING THEREOF
摘要 <p>A depositing arrangement for evaporation of a dielectric material onto a substrate is described. The deposition arrangement a vapor distribution showerhead, a holder for providing the dielectric material in the vapor distribution showerhead, wherein the holder has a feeding unit for feeding the dielectric material into the vapor distribution showerhead, an energy source configured for melting and evaporating the dielectric material in the vapor distribution showerhead or sublimating the dielectric material in the vapor distribution showerhead, wherein the vapor distribution showerhead has one or more outlets for directing the vaporized dielectric material towards a substrate, and particularly wherein the energy source emits electrons or photons, wherein the electrons or photons melt and evaporate the dielectric material or sublimate the dielectric material. The arrangement further includes a plasma source configured for providing a plasma between the vapor distribution showerhead and the substrate.</p>
申请公布号 WO2014096303(A1) 申请公布日期 2014.06.26
申请号 WO2013EP77575 申请日期 2013.12.20
申请人 APPLIED MATERIALS, INC.;KELLER, STEFAN;BANGERT, STEFAN;KWAK BYUNG-SUNG, LEO 发明人 KELLER, STEFAN;BANGERT, STEFAN;KWAK BYUNG-SUNG, LEO
分类号 H01J37/32;H01M4/04;H01M10/04 主分类号 H01J37/32
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