发明名称 TEMPERATURE SENSOR, MANUFACTURING METHOD THEREFOR AND CONNECTION METHOD OF LEAD FRAME
摘要 PROBLEM TO BE SOLVED: To provide a temperature sensor which allows for temperature measurement even under high temperature environment, while ensuring high bond strength of a pattern electrode and a lead frame, and to provide a manufacturing method therefor and a connection method of a lead frame.SOLUTION: A temperature sensor includes an insulating film 2, a thin film thermistor 3 patterned of a thermistor material on the surface of the insulating film, a pair of interdigital electrodes 4 formed on the thin film thermistor so as to face each other while having a plurality of combs, a pair of pattern electrodes 5 connected with the pair of interdigital electrodes and formed on the surface of the insulating film, and a pair of lead frames 6 arranged on the back of the insulating film on the opposite side of the pair of pattern electrodes, and connected therewith through a via hole H formed in the insulating film. The pair of lead frames are welded to a metal material M filling the via hole.
申请公布号 JP2014116550(A) 申请公布日期 2014.06.26
申请号 JP20120271486 申请日期 2012.12.12
申请人 MITSUBISHI MATERIALS CORP 发明人 INABA HITOSHI;NAGATOMO KENSHO
分类号 H01C7/04;G01K7/22;H01C17/12;H01C17/28 主分类号 H01C7/04
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