发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method which improve throughput.SOLUTION: A processing block 12 is disposed between an indexer block 11 and a processing block 13. One substrate W is transferred to a main transfer mechanism 128 of the processing block 12 by a main transfer mechanism 115 of the indexer block 11 and is transferred to a first processing part 121 and a heat treatment part 123 by the main transfer mechanism 128. Then, treatment is performed to the substrate W. The substrate W that has been exposed to the treatment is transferred to the main transfer mechanism 115 by the main transfer mechanism 128. Another substrate W is transferred to sub transfer mechanisms 117, 118 of a sub transfer chamber 110 by the main transfer mechanism 115 and is transferred to a main transfer mechanism 138 of the processing block 13 by the sub transfer mechanisms 117, 118. The substrate W is transferred to the sub transfer mechanisms 117, 118 by the main transfer mechanism 138 and is transferred to the main transfer mechanism 115 by the sub transfer mechanisms 117, 118.
申请公布号 JP2014116508(A) 申请公布日期 2014.06.26
申请号 JP20120270506 申请日期 2012.12.11
申请人 SOKUDO CO LTD 发明人 INAGAKI YUKIHIKO
分类号 H01L21/677;H01L21/027 主分类号 H01L21/677
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