发明名称 LIQUID DRAINING DEVICE AND LIQUID DRAINING METHOD FOR SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a liquid draining device and a liquid draining method for a semiconductor device, capable of preventing droplets from being scattered to the outside of the device.SOLUTION: A liquid draining device 20 comprises a fixed base 9, an air nozzle 3 for a casing, an air nozzle 4 for casing recess formation, a vertically movable cylinder 8, and an outer box 2 covering these components. A casing 1 is fixed to the fixed base 9, and liquid draining of the casing 1 is performed by the air nozzle 3 for the casing and the air nozzle 4 for casing recess formation. The air nozzle 3 for the casing and the air nozzle 4 for casing recess formation are fixed to a nozzle pedestal 7 and can be vertically moved by the vertically movable cylinder 8. Thus, in the state where air is jetted out, the air nozzle 3 for the casing and the air nozzle 4 for casing recess formation are slid while keeping an air jetting direction.</p>
申请公布号 JP2014116515(A) 申请公布日期 2014.06.26
申请号 JP20120270581 申请日期 2012.12.11
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKADA TOMOHIRO
分类号 H01L23/50 主分类号 H01L23/50
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