| 摘要 |
<p>PROBLEM TO BE SOLVED: To disclose a projection exposure apparatus for semiconductor lithography indicating improvement of heat management.SOLUTION: A projection exposure apparatus for semiconductor lithography comprises a projection objective lens. The projection objective lens includes a projection objective lens housing and an actuator system 1 for mechanical actuation of at least one optical component 7 disposed within the projection objective lens. The actuator system 1 includes at least one of means 60, 6, 2, 4 for reducing heat transfer into at least one optical component 7 caused by heat generated during operation of the actuator system 1. The actuator system includes an attenuation system, the attenuation system comprises a vibration-proof mass body including a damper, and the mass body is disposed outside of the objective lens housing.</p> |
