| 摘要 |
PROBLEM TO BE SOLVED: To prevent peeling of a junction of a sensor chip.SOLUTION: An O-ring 13-1 is interposed between an internal surface 12-1b of a sensor chamber 12a and one surface of a sensor chip 11 (an external surface of a pedestal 11-4), while being pressed and held. An O-ring 13-2 is interposed between an internal surface 12-2b of the sensor chamber 12a and the other surface of the sensor chip 11 (an external surface of a pedestal 11-5), while being pressed and held. One end of a pressure introducing pipe 14-1 is fixedly inserted into a pressure introducing hole (a continuous hole) 11-4a of the pedestal 11-4 of the sensor chip 11, and the other end is loosely inserted into a pressure introducing passage 12-1c of an upper side housing 12-1. One end of the pressure introducing pipe 14-1 is fixedly inserted into a pressure introducing hole (a continuous hole) 11-5a of the pedestal 11-5 of the sensor chip 11, and the other end is loosely inserted into a pressure introducing passage 12-2c of a lower side housing 12-2. |
