PACKAGE-LEVEL INTEGRATED CIRCUIT CONNECTION WITHOUT TOP METAL PADS OR BONDING WIRE

摘要

An integrated circuit method is provided with package-level connectivity, between internal electronic circuitry thereof and contact points on a package substrate thereof, without requiring top metal pads or bonding wires.

主权项

1. A method of producing an integrated circuit apparatus, comprising:
providing electronic circuitry within a wafer; sawing the wafer to produce an integrated circuit apparatus that contains said electronic circuitry and has an edge produced by said sawing; and providing within the wafer a plurality of conductors connected to said electronic circuitry and positioned to be exposed on said edge by said sawing to make said conductors physically accessible on said edge.