APPARATUS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES AND LIQUID CONTROL RING FOR USE IN SAME

摘要

An apparatus for treating a wafer-shaped article includes a rotary chuck configured to hold a wafer-shaped article of a predetermined diameter such that a surface of the wafer-shaped article facing the rotary chuck is spaced from an upper surface of the rotary chuck. A ring is mounted on the rotary chuck, and includes a first upper surface overlapping an outer peripheral edge of a wafer-shaped article when positioned on the rotary chuck and a second upper surface positioned radially inwardly of the first surface. The second upper surface is elevated relative to the first upper surface, to define an annular gap between the second upper surface and a wafer-shaped article when positioned on the spin chuck that is smaller than a distance between the first upper surface and a wafer-shaped article when positioned on the rotary chuck.

主权项

1. Apparatus for treating a wafer-shaped article, comprising:
a rotary chuck configured to hold a wafer-shaped article of a predetermined diameter such that a surface of the wafer-shaped article facing said rotary chuck is spaced from an upper surface of the rotary chuck; and a ring mounted on the rotary chuck, said ring comprising a first upper surface overlapping an outer peripheral edge of a wafer-shaped article when positioned on the rotary chuck and a second upper surface positioned radially inwardly of said first surface; wherein said second upper surface is elevated relative to said first upper surface, to define an annular gap between said second upper surface and a wafer-shaped article when positioned on the spin chuck that is smaller than a distance between said first upper surface and a wafer-shaped article when positioned on the rotary chuck; and wherein said ring comprises a lower surface that is spaced from a body of the rotary chuck.