| 主权项 |
1. An epoxy resin composition for encapsulation of a semiconductor device, the epoxy resin composition comprising: an epoxy resin including repeat units represented by Formulae 1 and 2; a curing agent; a curing accelerator; and an inorganic filler, wherein, in Formula 1, R1, R2, R3, R4, R5 and R6 are each independently hydrogen or a linear or branched C1 to C5 alkyl group; a and b are each independently an integer from 0 to 3; c and d are each independently an integer from 0 to 4; and e and f are each independently an integer from 0 to 5, wherein, in Formula 2, R1, R2, R3, R4, R5 and R6 are each independently hydrogen or a linear or branched C1 to C5 alkyl group; a and b are each independently an integer from 0 to 3; and c, d, e and f are each independently an integer from 0 to 4. |
