| 摘要 |
According to one embodiment, electronic device includes casing, circuit board, joint component, and bonding agent. The circuit board is held in the casing, includes first face and second face opposite the first face, and includes a first opening provided on the first face. The joint component includes: insertion portion that is inserted into the first opening; protruding portion that protrudes from the insertion portion toward a side opposite the second face; first end of the protruding portion provided at a side opposite the second face; and support portion extended along the first face. The joint component includes a second opening provided on the first end, extended to the insertion portion, and into which a joint tool is inserted. The bonding agent is provided between the insertion portion and the first opening and between the support portion and the first face, and bonds the circuit board and the joint component. |
| 主权项 |
1. An electronic device comprising:
a casing; a circuit board held in the casing, comprising a first face and a second face opposite the first face, and comprising a first opening provided on the first face; a joint component comprising:
an insertion portion configured to be inserted into the first opening;a protruding portion configured to protrude from the insertion portion toward a side opposite the second face;a first end of the protruding portion provided at a side opposite the second face; anda support portion extended along the first face, whereinthe joint component comprises a second opening provided on the first end, extended to the insertion portion, and into which a joint tool is inserted; and a bonding agent provided between the insertion portion and the first opening and between the support portion and the first face, and configured to bond the circuit board and the joint component with each other. |
