ABSORBING EXCESS UNDER-FILL FLOW WITH A SOLDER TRENCH

摘要

One embodiment sets forth an integrated circuit package that includes a substrate, one or more devices mounted on the substrate, a layer of under-fill configured to secure the one or more devices on the substrate, and a solder trench formed in the substrate, where the aggregate volume of the solder trench is large enough to capture a flow of excess under-fill during fabrication. One advantage of the disclosed integrated circuit package is that the solder trench is used in lieu of solder dam structures, thereby allowing a stencil to be lowered closer to the substrate surface during fabrication, which facilitates depositing solder paste during fabrication.

主权项

1. An integrated circuit package, comprising:
a substrate; one or more devices mounted on the substrate; one or more electrical connections disposed between the substrate and the one or more devices; a layer of under-fill configured to secure the one or more devices on the substrate; and a solder trench formed in the substrate, wherein the aggregate volume of the solder trench is large enough to capture a flow of excess under-fill during fabrication.