DEVICE FOR PEELING SUBSTRATE, METHOD FOR PEELING SUBSTRATE AND METHOD FOR PRODUCING ELECTRONIC DEVICE

摘要

The present invention relates to a peeling device for a substrate which sequentially peels interfaces of a substrate and a reinforcing plate reinforcing the substrate in the peeling processing direction from a end unit to the other end unit. The peeling device includes peeling means to peel the interfaces to make the angle between the tangent of an end unit of the border line between the peeling area without the interface and a non-peeling area and the tangent on the outer periphery of the substrate to be more than 90 degrees in a range where the angle between the straight line connecting the border line and two intersection points on the outer periphery and the tangent of the outer periphery of the substrate in the peeling area.