SEMICONDUCTOR CHIPS SUSCEPTIBLE OF TESTING THE INTERCONNECTION DURING THE CHIP MOUNTING, SEMICONDUCTOR PACKAGE USING THE CHIPS, METHOD OF TESTING THE INTERCONNECTION IN THE SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICATING THE SEMICONDUCTOR PACKAGE USING THE CHIPS

摘要

A semiconductor chip, according to an embodiment of the present invention, comprises a chip body, through vias which penetrate the chip body, a tag circuit which is arranged in the chip body and transmits a test signal, signal lines which electrically connect the through vias and the tag circuit, fuses which are arranged in the middle of each of the signal lines, a fuse controller which is arranged in the chip body and transmits a fuse control signal, and fuse control lines which provide a path which transmits the fuse control signal from the fuse controller to the fuses.