LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE, LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE WITH RESIN, MULTIPLE IMPOSITION BODY OF LEAD FRAME, MULTIPLE IMPOSITION BODY OF LEAD FRAME WITH RESIN, OPTICAL SEMICONDUCTOR DEVICE, AND MULTIPLE IMPOSITION BODY OF OPTICAL SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a lead frame for an optical semiconductor element, a lead frame for an optical semiconductor element with a resin, a multiple imposition body of a lead frame, a multiple imposition body of a lead frame with a resin, an optical semiconductor device, and a multiple imposition body of an optical semiconductor device capable of suppressing damage by a resin part of a cavity between terminal portions even when an external force or the like is applied.SOLUTION: A lead frame 10 comprises a plurality of terminal portions 11, 12 which are insulated from each other, and at least one of the terminal portions 11, 12 is used in an optical semiconductor device 1 connected to an LED element 2. The terminal portion 11 includes a coupling portion 13d on an extension of a cavity S between the terminal portion 11 and the other terminal portion 12 opposed to the terminal portion 11.