| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser processing device capable of preventing debris from adhering onto a workpiece surface and preventing an outer peripheral region of a chuck table from being damaged.SOLUTION: A laser processing device comprises: a chuck table for holding a plate-like workpiece; and laser beam irradiation means including a machining head for irradiating the plate-like workpiece held on the chuck table with a laser beam. The chuck table includes: a workpiece holding unit that holds the plate-like workpiece; and an outer peripheral portion that surrounds the plate-like workpiece held by the workpiece holding unit. The workpiece holding unit includes: liquid-column clearance grooves defining a plurality of chip holding regions corresponding to planned cut lines of the plate-like workpiece, respectively; attraction holes formed in the chip holding regions, respectively; and an attraction path communicating with the attraction holes, and connected to an attraction source. The outer peripheral portion of the chuck table includes a liquid storage unit storing therein liquid jetted from liquid jet means of the machining head. |
