发明名称 SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To reduce leakage current.SOLUTION: A semiconductor device includes: an oxide layer; a source electrode layer in contact with the oxide layer; a first drain electrode layer in contact with the oxide layer; a second drain electrode layer in contact with the oxide layer; a gate insulating film in contact with the oxide layer; a first gate electrode layer overlapped with the source electrode layer and the first drain electrode layer and overlapped with an upper surface of the oxide layer with the gate insulating film interposed therebetween; a second gate electrode layer overlapped with the source electrode layer and the second drain electrode layer and overlapped with the upper layer of the oxide layer with the gate insulating film interposed therebetween; and a third gate electrode layer overlapped with a side surface of the oxide layer with the gate insulating film interposed therebetween.</p>
申请公布号 JP2014116582(A) 申请公布日期 2014.06.26
申请号 JP20130215239 申请日期 2013.10.16
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI;KOYAMA JUN;KATO KIYOSHI
分类号 H01L29/786;H01L21/336;H01L21/8242;H01L21/8247;H01L27/108;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L29/786
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