| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a light emitting diode package capable of preventing light emission efficiency from being reduced, the light emitting diode package including a plurality of light emitting diode chips, and a manufacturing method thereof.SOLUTION: In the light emitting diode package and the manufacturing method thereof, a plurality of light emitting diode chips are packaged on a circuit board, dome-shaped high refractive resin layers are formed over the plurality of light emitting diode chips, a partition wall formed from a low refractive resin and a fluorescent layer formed in a region defined by the partition wall are formed individually, the fluorescent layer is then deposited on the high refractive resin layer. Thus, color coordinates of light passing through the individually formed fluorescent layer are checked and a plurality of phosphors with no variation in color coordinates are then deposited on the plurality of light emitting diode chips, thereby preventing quality deterioration. Further, efficiency of light can be prevented from being reduced by a refractive index difference between the light emitting diode chip and the fluorescent layer.</p> |
