WATER SOLUBLE MASK FOR SUBSTRATE DICING BY LASER AND PLASMA ETCH

摘要

Methods of dicing substrates having a plurality of ICs are disclosed. A method includes forming a mask comprising a water soluble material layer over the semiconductor substrate. The mask is patterned with a femtosecond laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the substrate between the ICs. The substrate is then etched through the gaps in the patterned mask to singulate the IC and the water soluble material layer is washed off.

主权项

1. A system for dicing a semiconductor substrate comprising a plurality of ICs, the system comprising:
a laser scribe module to pattern a mask and expose regions of the substrate between the ICs, the mask comprising a layer of the water soluble material; a plasma etch module physically coupled to the laser scribe module to singulate the ICs by plasma etching of the substrate; a robotic transfer chamber to transfer a laser scribed substrate from the laser scribe module to the plasma etch module; and a wet process module to wash off a water soluble mask after plasma etching the substrate.