VERFAHREN ZUR INTEGRATION EINES BAUTEILS IN EINE LEITERPLATTE ODER EIN LEITERPLATTEN-ZWISCHENPRODUKT SOWIE LEITERPLATTE ODER LEITERPLATTEN-ZWISCHENPRODUKT

摘要

A method for integrating a component into a printed circuit board or printed circuit board intermediate product comprises the following steps: - providing a layer (1) for supporting at least temporarily the component (4) to be integrated, - fixing the component (4) to be integrated on the supporting layer (1), - providing a printed circuit board element (9) with a cavity (10) having dimensions that at least correspond to the size and shape of the component (4) to be integrated, - fixing the printed circuit board element (9) on the supporting layer (1), the component (4) to be integrated being accommodated in the cavity (10). The printed circuit board element (9) that has the cavity (10) for receiving the component (4) to be integrated is formed by at least one non-conductive layer of the printed circuit board or the printed circuit board intermediate product to be produced. In addition, a printed circuit board or a printed circuit board intermediate product is provided.