SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which enables uniform formation of an encapsulation resin by inhibiting a jetting phenomenon occurring due to an increase in injection rate of the resin with an increase in size of the semiconductor device thereby to improve insulation reliability.SOLUTION: A semiconductor device comprises: a metallic member 2 on which a semiconductor element 20 is mounted on one surface; a printed wiring board 3 which is arranged opposite to the metallic member 2 and has convex parts 13 at least on one side, and on which an electric component 4 is mounted; and an encapsulation resin 10 for encapsulating the metallic member 2 and the printed wiring board 3. The encapsulation resin 10 is encapsulated by use of a mold 21 and injected from injection ports 16 of the mold 21, which are opposite to the convex parts 13.