SEMICONDUCTOR DEVICE HAVING CONDUCTIVE VIA AND MANUACTURING PROCESS

摘要

In accordance with the present invention, there is provided a semiconductor device comprising a semiconductor die or chip, a package body and a through package body via. The semiconductor chip includes a plurality of conductive pads. The package body encapsulates a sidewall of the semiconductor chip, and has at least one hole formed therein having a sidewall which is of a prescribed first surface roughness value. The through package body via is disposed in the hole of the package body and comprises a dielectric material and at least one conductive interconnection metal. The dielectric material is disposed on the sidewall of the hole and defines at least one bore having a sidewall which is of a second surface roughness value less than the first surface roughness value. The interconnection metal is disposed within the bore.

主权项

1. A semiconductor device, comprising:
a semiconductor chip including a plurality of conductive pads: a package body at least partially encapsulating the semiconductor chip the package body having at least one hole formed therein defining a hole sidewall which is of a first surface roughness value; and at least one through package body via disposed in the hole, the via comprising, a dielectric material disposed on the hole sidewall of the hole and defining at least one bore having a bore sidewall which is of a second surface roughness value less than the first surface roughness value.