METHODS OF FORMING ULTRA THIN PACKAGE STRUCTURES INCLUDING LOW TEMPERATURE SOLDER AND STRUCTURES FORMED THERBY

摘要

Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include attaching a device to a patch substrate, wherein the assembled device and patch substrate comprise a warpage, attaching the assembled device and patch substrate to an interposer to form a package structure, and then reflowing the package structure at a temperature below about 200 degrees Celsius to form a substantially flat package structure.

主权项

1. A method of forming a structure comprising:
attaching a device to a patch substrate, wherein the assembled device and patch substrate comprise a warpage; attaching the assembled device and patch substrate to a substrate to form a package structure; and reflowing the package structure at a temperature below about 200 degrees Celsius to form a substantially flat package structure.