发明名称 |
METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMPS AND STRUCTURES FORMED THEREBY |
摘要 |
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include modifying an underfill material with one of a thiol adhesion promoter, an azole coupling agent, surface modified filler, and peroxide based cross-linking polymer chemistries to greatly enhance adhesion in package structures utilizing the embodiments herein. |
申请公布号 |
US2014175634(A1) |
申请公布日期 |
2014.06.26 |
申请号 |
US201213721266 |
申请日期 |
2012.12.20 |
申请人 |
Bai Yiqun;Wei Yuying;Krishnan Arjun;Ramalingam Suriyakala;Xiu Yonghao;Canham Beverly J.;Nagarajan Sivakumar;Jayaraman Saikumar;Ananthakrishnan Nisha |
发明人 |
Bai Yiqun;Wei Yuying;Krishnan Arjun;Ramalingam Suriyakala;Xiu Yonghao;Canham Beverly J.;Nagarajan Sivakumar;Jayaraman Saikumar;Ananthakrishnan Nisha |
分类号 |
H01L23/29;H01L21/56 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
1. A method of forming a package structure comprising:
forming an underfill material on conductive bumps of the package structure, wherein the underfill material comprises a thiol based adhesion promoter, wherein the thiol based adhesion promoter comprises a molecular molecular weight above about 150 g/mol. |
地址 |
Chandler AZ US |