发明名称 Method of Fabricating a Gate all Around Device
摘要 The device includes a wafer substrate including an isolation feature, a fin base embedded in the isolation feature, at least one channel disposed above the fin base, and a gate stack disposed around the channel, wherein the gate stack includes a top portion and a bottom portion of the gate stack formed by filling a cavity around the channel such that the top portion and bottom portion are aligned each other. The device further includes at least one source and one drain disposed over the fin base, wherein the channel connects the source and the drain. The device further includes the source and the drain disposed over a fin insulator disposed over the fin base.
申请公布号 US2014175561(A1) 申请公布日期 2014.06.26
申请号 US201213725536 申请日期 2012.12.21
申请人 Company, Ltd. Taiwan Semiconductor Manufacturing 发明人 Colinge Jean-Pierre;Ching Kuo-Cheng;Wu Zhiqiang
分类号 H01L29/78;H01L29/66 主分类号 H01L29/78
代理机构 代理人
主权项
地址 US