发明名称 |
METHOD AND STRUCTURE FOR CARRIER-LESS THIN WAFER HANDLING |
摘要 |
Methods of forming a microelectronic assembly and the resulting structures and devices are disclosed herein. In one embodiment, a method of forming a microelectronic assembly includes removing material exposed at portions of a surface of a substrate to form a processed substrate having a plurality of thinned portions separated by integral supporting portions of the processed substrate having a thickness greater than a thickness of the thinned portions, at least some of the thinned portions including a plurality of electrically conductive interconnects extending in a direction of the thicknesses of the thinned portions and exposed at the surface; and removing the supporting portions of the substrate to sever the substrate into a plurality of individual thinned portions, at least some individual thinned portions including the interconnects. |
申请公布号 |
WO2014100186(A2) |
申请公布日期 |
2014.06.26 |
申请号 |
WO2013US76137 |
申请日期 |
2013.12.18 |
申请人 |
INVENSAS CORPORATION |
发明人 |
UZOH, CYPRIAN, EMEKA;MONADGEMI, PEZHMAN;NEWMAN, MICHAEL;WOYCHIK, CHARLES, G.;CASKEY, TERRENCE |
分类号 |
H01L21/768 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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