| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition apparatus which can provide a substrate with a coating having substantially uniform film thickness.SOLUTION: A film deposition apparatus 1 according to this invention includes: a vacuum chamber 2 accommodating a substrate W; evaporation sources 4 provided on an internal surface of the vacuum chamber 2; and a substrate holding part 6 on which the substrate W is disposed and which holds the disposed substrate W, and performs PVD treatment to the surface of the substrate W. In the film deposition apparatus 1, multiple of the evaporation source 4 are disposed in a direction L which is vertical to a transfer direction of the substrate holding part 6. At least one of first evaporation sources 4a and 4d among the disposed multiple of the evaporation source 4, which are disposed at two ends in the direction L which is vertical to the transfer direction of the substrate holding part 6, is disposed so as to protrude to the substrate W side from second evaporation sources 4b and 4c which are adjacent to the first evaporation source 4a in the direction L vertical to the transfer direction of the substrate holding part 6. |
