OPTICAL RECEIVER MODULE

摘要

An optical receiver module may include a demultiplexer routing a plurality of multiplexed optical signals to different optical paths depending on their wavelengths, a photodetector provided spaced apart from the demultiplexer to convert the optical signals into electric signals, respectively, a pre-amplifier electrically connected to the photodetector to amplify intensities of the electric signals, a flexible printed circuit board including a first electrode layer, which is electrically connected to the pre-amplifier to transmit the electric signals to the external circuit, and a second electrode layer configured to supply a ground potential. The flexible printed circuit board are provided not to have any via hole between the first and second electrode layers.

主权项

1. An optical receiver module based on a wavelength division multiplexing (WDM) technology, comprising:
a demultiplexer routing a plurality of multiplexed optical signals to different optical paths depending on their wavelengths; an optical device including a mirror and a plurality of lenses, wherein the mirror is configured to reflect the optical signals, which are separated by the demultiplexer and are propagated along a horizontal direction, toward a vertical direction, and the lenses are configured in such a way that the optical signals to be reflected from the mirror transmit therethrough; a plurality of photodetectors provided spaced apart from the lenses to convert the optical signals transmitted from the lenses into electric signals, respectively; and a flexible printed circuit board configured to transmit the electric signals converted by the photodetectors to an external circuit, wherein the plurality of the lenses and the plurality of the photodetectors are fabricated in a form of a single array, the flexible printed circuit board comprises a first electrode layer for transmitting the electric signals to the external circuit and a second electrode layer for supplying a ground potential, and the first and second electrode layers are provided in a form of a microstrip line, and the flexible printed circuit board has a via-hole-free structure.