| 摘要 |
An exemplary package substrate includes a package substrate, a first connection substrate, a first chip, a dielectric adhesive sheet, a second chip, and a second connection substrate. The package substrate includes many first and second electrical contact pads. The first connection substrate includes many third and fourth electrical contact pads. Each fourth electrical contact pad is electrically connected to one first electrical contact pad. The first chip includes many first electrode pads. Each first electrode pad is electrically connected to the corresponding third electrical contact pad. The second chip is connected to the first chip by the dielectric adhesive sheet, and includes many second electrode pads. The second connection substrate includes many fifth and sixth electrical contact pads. Each fifth electrical contact pad is electrically connected to one second electrode pad, and each sixth electrical contact pad is electrically connected to one second electrical contact pad. |
| 主权项 |
1. A package structure comprising:
a package substrate, the package substrate comprising a plurality of first electrical contact pads, and a plurality of second electrical contact pads; a first connection substrate, the first connection substrate comprising a plurality of third electrical contact pads, and a plurality of fourth electrical contact pads spatially corresponding to the first electrical contact pads, each fourth electrical contact pad being electrically connected to the corresponding first electrical contact pad; a first chip, the first chip comprising a plurality of first electrode pads spatially corresponding to the third electrical contact pads, each first electrode pad being electrically connected to the corresponding third electrical contact pad; a dielectric adhesive sheet; a second chip, the second chip being connected to the first chip by the dielectric adhesive sheet, the second chip comprising a plurality of second electrode pads, and a second connection substrate, the second connection substrate comprising a plurality of fifth electrical contact pads spatially corresponding to the second electrode pads, and a plurality of sixth electrical contact pads spatially corresponding to the second electrical contact pads, each fifth electrical contact pad being electrically connected to the corresponding second electrode pad, and each sixth electrical contact pad being electrically connected to the corresponding second electrical contact pad. |
