| 发明名称 |
SEMICONDUCTOR PACKAGES INCLUDING SEMICONDUCTOR CHIPS HAVING PROTRUSIONS AND METHODS OF FABRICATING THE SAME |
| 摘要 |
The semiconductor package includes an upper semiconductor chip stacked on a package substrate and a support layer or a lower semiconductor chip disposed between the upper semiconductor chip and the package substrate. The upper semiconductor chip includes a protrusion downwardly extending from an edge thereof. The protrusion of the upper semiconductor chip is combined with a sidewall of the support layer or the lower semiconductor chip. Related methods are also provided. |
| 申请公布号 |
US2014175638(A1) |
申请公布日期 |
2014.06.26 |
| 申请号 |
US201313846713 |
申请日期 |
2013.03.18 |
| 申请人 |
SK HYNIX INC. |
发明人 |
KIM Ji Eun;JOH Cheol Ho;SHIN Hee Min;LEE Kyu Won;CHO Chong Ho |
| 分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package comprising:
an upper semiconductor chip stacked on a package substrate, including a protrusion downwardly extending from an edge thereof; and a support layer or a lower semiconductor chip between the upper semiconductor chip and the package substrate, wherein the protrusion of the upper semiconductor chip is combined with a sidewall of the support layer or the lower semiconductor chip. |
| 地址 |
Icheon-si Gyeonggi-do KR |
