| 摘要 |
The present invention provides a conductive coating film forming bath which is composed of an aqueous solution that contains (A) a copper compound, (B) a complexing agent, (C) an alkali metal hydroxide, (D) an aliphatic polyalcohol compound having 2-5 carbon atoms, and (E) at least one compound that is selected from the group consisting of reducing compounds having a -COOM group (wherein M represents H, an alkali metal or an -NH4 group) and reducing saccharides having 6 or more carbon atoms. According to the present invention, there is provided a composition for forming a conductive coating film that exhibits excellent performance as a base for electroplating, said conductive coating film able to be effectively utilized in order to form a uniform decorative electroplating film having excellent appearance on a non-conductive plastic molded article. |
