| 摘要 |
<p>A relief structure (7) is formed on a surface (12) of a carrier (2) provided for accomodating a wafer (1), which is fastened to the carrier by a removable adhesive (3) contacting the carrier. The relief structure, which may be spatially confined to the centre of the carrier, reduces the strength of adhesion between the wafer and the carrier. If the adhesive is appropriately selected and maintains the connection between the wafer and the carrier at elevated temperatures, further process steps can be performed at temperatures of typically 300°C or more. The subsequent mechanical separation of the adhesive joint is facilitated by the relief structure on the carrier.</p> |
