| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a high thermal-conductivity printed circuit board which, even when mounting density of a power LED and a power IC or the like having a large calorific value is improved, is equipped with excellent radiation performance allowing these electronic components to complete a design life.SOLUTION: A high thermal-conductivity printed wiring board or the like is adopted which is characterized in that, in a printed wiring board using an aluminum substrate, the aluminum substrate with an alumite layer having the alumite layer on the surface of the aluminum substrate is used to have a heat-resistant insulating resin layer on the surface of the alumite layer and a copper circuit layer on the surface of the heat-resistant insulating resin layer.</p> |
