发明名称 |
SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can inhibit voids and achieve high reliability.SOLUTION: A semiconductor device manufacturing method comprises a process of thermal pressure bonding a semiconductor chip on which a film adhesive is bonded on a bump electrode formation surface with a substrate on which a film adhesive is bonded so as to oppose the film adhesives to each other. |
申请公布号 |
JP2014116503(A) |
申请公布日期 |
2014.06.26 |
申请号 |
JP20120270470 |
申请日期 |
2012.12.11 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
SADANAGA SHUJIRO;NAKAGAWA HIROAKI;NISHIMURA YOSHIO |
分类号 |
H01L21/60;C09J7/00;C09J11/04;C09J201/00 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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