| 发明名称 |
Gold Pad Mini PCB Module |
| 摘要 |
A printed circuit board (PCB) assembly includes a first printed circuit board that includes first circuit traces formed of copper. A second printed circuit board includes second circuit traces that are formed of nickel/gold plated copper and terminations that are soldered to the first circuit traces. An electrical component contacts the second circuit traces. |
| 申请公布号 |
US2014177175(A1) |
申请公布日期 |
2014.06.26 |
| 申请号 |
US201213725922 |
申请日期 |
2012.12.21 |
| 申请人 |
CONTINENTAL AUTOMOTIVE SYSTEMS, INC. |
发明人 |
Daniel Daniel Bracamontes;Rodriquez Irving Morales;Gonzalez Anel Ortiz;Cano Gil Rene Sosa;Millard Jurgen Christian Hagedorn |
| 分类号 |
H05K1/09 |
主分类号 |
H05K1/09 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board (PCB) assembly, comprising:
a first printed circuit board that includes first circuit traces formed of copper; a second printed circuit board that includes second circuit traces that are formed of nickel/gold plated copper and terminations that are soldered to the first circuit traces; and an electrical component that contacts the second circuit traces. |
| 地址 |
Auburn Hills MI US |
