| 发明名称 |
DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE |
| 摘要 |
The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface contains a black pigment. |
| 申请公布号 |
US2014175677(A1) |
申请公布日期 |
2014.06.26 |
| 申请号 |
US201414188991 |
申请日期 |
2014.02.25 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
TAKAMOTO Naohide;MATSUMURA Takeshi;SHIGA Goji |
| 分类号 |
H01L21/683;H01L23/00 |
主分类号 |
H01L21/683 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A dicing tape-integrated film for semiconductor back surface, comprising:
a dicing tape comprising a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, wherein the film for flip chip type semiconductor back surface contains a black pigment. |
| 地址 |
Osaka JP |
