POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE, PASTE FOR COPPER PLATE JUNCTION, AND METHOD FOR MANUFACTURING JOINED BODY

摘要

PROBLEM TO BE SOLVED: To provide a power module substrate, which is formed by joining a copper plate made of copper or a copper alloy onto a ceramic substrate, capable of suppressing an occurrence of cracks in the ceramic substrate at the time of cooling/heating cycle load, and also to provide a power module substrate with a heat sink, a power module, a method for manufacturing a power module substrate, a paste for copper plate junction and a method for manufacturing a joined body.SOLUTION: A power module substrate is obtained by laminating and bonding a copper plate made of copper or a copper alloy onto a surface of a ceramic substrate 11. Between the copper plate and the ceramic substrate 11, an oxide layer 31 is formed on the surface of the ceramic substrate 11 and the thickness of an Ag-Cu eutectic structure layer 32 is made to be 15 μm or less.