发明名称 MANAGEMENT METHOD OF COMPONENT MOUNTING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method capable of managing a component mounting substrate used in a roll to roll system without breaking or deteriorating electronic components mounted on the substrate.SOLUTION: When managing a component mounting substrate having flexibility and with a plurality of electronic components mounted thereon by winding the substrate on a winding core so as to make a roll, the roll is held so that the winding core of the roll becomes parallel to the vertical direction.
申请公布号 JP2014116437(A) 申请公布日期 2014.06.26
申请号 JP20120268887 申请日期 2012.12.08
申请人 NICHIA CHEM IND LTD 发明人 OMURA SHINGO
分类号 H01L21/60;H01L33/48;H05K13/04 主分类号 H01L21/60
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