发明名称 LIGHT EMITTING DIODE SEALING COMPOSITION, PHOSPHOR SHEET, LED PACKAGE EMPLOYING THE SAME AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To improve luminance of an LED package employing a light emitting diode sealing composition to which fine particles are added.SOLUTION: A light emitting diode sealing composition contains a matrix resin, a phosphor and a plurality of fine particles having different refraction indices. A concentration of fine particles having a refraction index closest to that of the matrix resin, among the fine particles, in a solid component in the sealing composition is 1 to 30 vol%, and a concentration of the other fine particles in the solid component in the sealing composition is 0.001 to 0.045 vol%.
申请公布号 JP2014116598(A) 申请公布日期 2014.06.26
申请号 JP20130235622 申请日期 2013.11.14
申请人 TORAY IND INC 发明人 SHIGETA KAZUKI;ISHIDA YUTAKA;MATSUMURA NOBUO;KAWAMOTO KAZUNARI
分类号 H01L33/56;H01L33/50 主分类号 H01L33/56
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