| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a cylindrical grinder and a manufacturing method of a single-crystal wafer, with which high-quality single-crystal wafers with variations in a radius in a circumferential direction suppressed can be efficiently obtained after a cylindrical grinding step, a slicing step and an etching step.SOLUTION: A manufacturing method of a single-crystal wafer includes the steps of; cylindrically grinding an outer circumferential part of a single-crystal ingot; slicing the ground ingot into a wafer shape; and etching the outer circumferential part of the single-crystal wafer. In the method, the single-crystal wafer is manufactured by executing the cylindrical grinding step, the slicing step and the etching step while changing a radius of the ingot by periodically changing and controlling a grindstone feeding amount in a vertical direction to an ingot axis of a grindstone in accordance with a position of the ingot in the circumferential direction so as to cancel a periodical radius change amount caused by etching on the basis of the periodical radius change amount corresponding to the position of the wafer in the circumferential direction in the etching step.</p> |
