| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board which exhibits a function similar to that of a through hole easily, by forming a pair of blind via holes facing each other from front and back, and allows for mounting of a component at the through hole function part, and thereby high density wiring design.SOLUTION: A multilayer printed wiring board includes a first printed wiring board having a first conductive layer and a second conductive layer, and a second printed wiring board having a second conductive layer. The first printed wiring board and second printed wiring board are bonded while sandwiching a substrate adhesion layer. Furthermore, a front side blind via hole is provided from the first conductive layer of the first printed wiring board to the front side, and a back side blind via hole is provided from the first conductive layer to the back side. The back side blind via hole is disposed at a position overlapping the front side blind via hole, in the plan view. |
