发明名称 FLAT PLATE TYPE SPUTTERING TARGET AND PRODUCTION METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a stably-usable IGZO flat plate type sputtering target having excellent yield in production, and not generating a crack even when being used in high output, because a target material has no residual stress strain, concerning a flat plate type sputtering target, and to provide a production method thereof.SOLUTION: Since an IGZO flat plate type sputtering target having no residual stress strain inside a target material becomes producible by subjecting the target material after being sintered before being ground to anneal heating, and thereby the IGZO flat plate type sputtering target having excellent yield in production, and not generating a crack even when being used in high output can be obtained.
申请公布号 JP2014114473(A) 申请公布日期 2014.06.26
申请号 JP20120268395 申请日期 2012.12.07
申请人 TOSOH CORP 发明人 KOGO MASANORI;ONOMI KENJI;HARA SHINICHI;ITO KENICHI;SHIBUTAMI TETSUO
分类号 C23C14/34 主分类号 C23C14/34
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