发明名称 LIGHTING DEVICE AND LIGHT-EMITTING MODULE
摘要 A lighting device pertaining to one aspect of the present invention includes a mount, a light-emitting module, and a substrate holder. The light-emitting module is mounted on a main surface of the mount, and the substrate holder covers a portion of the light-emitting module and is connected with the mount. The light-emitting module includes a substrate, a plurality of light-emitting elements, a sealant and a padding. The padding is provided on a first main surface of the substrate. The light-emitting module is mounted on the main surface of the mount such that a second main surface of the substrate comes into contact with the main surface of the mount, and the light-emitting module is fixed to the mount by pressure applied from the substrate holder via the padding brought into contact with the substrate holder. The padding is made of a same material as the sealant.
申请公布号 US2014177240(A1) 申请公布日期 2014.06.26
申请号 US201314108805 申请日期 2013.12.17
申请人 PANASONIC CORPORATION 发明人 NORO Koji;SEKI Katsushi;KOTERA Ryusuke;TACHINO Youji;FUKANO Satoshi;HIRANO Akihiro
分类号 F21V15/04;F21S8/04 主分类号 F21V15/04
代理机构 代理人
主权项 1. A lighting device comprising: a mount; a light-emitting module mounted on a main surface of the mount; a substrate holder covering a portion of the light-emitting module and connected with the mount, wherein the light-emitting module includes: a substrate;a plurality of light-emitting elements mounted on a first main surface of the substrate;a sealant located on the first main surface of the substrate and sealing the plurality of light-emitting elements; anda padding located on the first main surface of the substrate, the light-emitting module is mounted on the main surface of the mount such that a second main surface of the substrate, which is on the opposite side of the substrate as the first main surface, comes into contact with the main surface of the mount, and the light-emitting module is fixed to the mount by pressure applied from the substrate holder via the padding brought into contact with a surface of the substrate holder, the surface facing toward the main surface of the mount, and the padding is made of a same material as the sealant.
地址 Osaka JP