| 摘要 |
<p>The invention relates to a method for brazing an electronic component, such as an electronic power component, to a printed circuit comprising a flow hole, said method including at least the following steps: depositing the electronic component in a location on the printed circuit that includes the flow hole; and brazing the electronic component to the printed circuit by flowing a molten brazing paste into the flow hole, such that an opening in the flow hole is plugged by a solder bump.</p> |
