HEAT RESISTANT NON-SILICONE RELEASE FILMS

摘要

The present invention relates to a heat resistant non-silicone release film and, more specifically, to a heat resistant non-silicone release film which, upon molding a heat resistant adhesive resin and film or molding a semi-harden (B-stage) resin and manufacturing a glass fiber, carbon fiber prepreg, etc., has excellent wettability and adhering stability thereby having excellent moldability, and thus capable of being used as a carrier film. Therefore, the heat resistant non-silicon release film according to the present invention is characterized by a heat resistant substrate film, at least one side of which comprises a coating layer in which a non-silicon release composition is coated.